I doubt the perforated "mobo" is typically the base to some sort of backpack.
Usually MOLLE frames or frames similar have some sort of contour to fit to your back.
I've been thinking largely about this since last night.
Here are two really crappy pictures of the bottom of the pack I took at SDCC:
In the pictures by monolith21, you can see that the odd angles at the top of the motherboard have almost no perforation.
You can also see that the design changes greatly toward the bottom of the pack. Most of the vertically-stacked punched holes become horizontal slits.
You can also see that the last slits nearest the rounded corners do NOT have circular holes beside them as the slits beneath them do, alluding to the fact that there was supposed to be a rounded corner there.
So either these are completely custom, and have a lot of unnecessary design work put into them to make our lives more difficult, or they are a completely stock piece, where the bend at the bottom and the cuts on the top and at the base are completely unmodified.